Scholarship

AAMI Foundation Dr. Michael Scholla Packaging Engineer Scholarship

2027 cycle

Accepting entries through January 15, 2027

Award amount: $3,000

About

The Dr. Michael Scholla Packaging Engineer Scholarship is a $3,000 annual award created by the AAMI Foundation in partnership with DuPont Tyvek Healthcare Packaging and Beacon Converters to help students studying medical and pharmaceutical packaging. These leaders in the healthcare packaging industry spearheaded and helped fund the scholarship to honor Dr. Scholla’s legacy and support new professionals in the field.

Eligibility

Applicants should: - Be enrolled in a formal undergraduate or graduate program related to medical or pharmaceutical packaging. - Planning to purse a position in industry after graduation.